Polishing apparatus
AssigneeEbara Corporation
InventorsTetsuji Togawa, Takeshi Sakurai, Nobuyuki Takada
Life of this patent
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Abstract
A polishing apparatus includes a cleaning device for critical cleaning of a top ring or a dressing tool to obtain high quality polishing by minimizing surface damage caused by contaminants originating from the top ring and/or dressing tool. The polishing apparatus includes a polishing table; a workpiece holding member for pressing a workpiece onto the polishing table; a dressing tool for conditioning a work surface provided on the polishing table. A cleaning device is provided for cleaning the dressing tool and/or the workpiece holding member. The cleaning device is provided with a spray nozzle for directing a cleaning solution toward at least an upper surface of the workpiece holding member or the dressing tool.
Claims26
A polishing apparatus comprising:
- a polishing table having a work surface;
- a workpiece holding member to press a workpiece to be polished onto said polishing table;
- a dressing tool to condition said work surface;
- and
- a cleaning device to clean said dressing tool, said cleaning device including a spray nozzle to direct a cleaning solution toward at least an upper surface of said dressing tool.
A dressing apparatus comprising:
- a dressing tool to condition a work surface on a polishing table;
- and
- a cleaning device to clean said dressing tool, said cleaning device including a spray nozzle to direct a cleaning solution toward at least an upper surface of said dressing tool.
Dependencies are inferred from the claim text.