Composition and method for planarizing surfaces
AssigneesCabot Corporation, Cabot Microelectronics Corporation
InventorsBrian L. Mueller, James A. Dirksen
Life of this patent
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Abstract
A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
Claims22
A composition for planarizing or polishing a surface comprising (a) a liquid carrier and (b) solids comprising about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm.
A method of planarizing or polishing a surface comprising contacting a surface with a composition comprising (a) a liquid carrier and (b) solids comprising about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm.
Dependencies are inferred from the claim text.