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US 6,318,451 B1Granted
Heat sink for integrated circuit
AssigneeFoxconn Precision Components Co., Ltd.
InventorsChao-Yang Lee, Yeu-Lih Lin, Chao Kun Tseng
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Abstract
A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.
Claims1
A heat sink assembly comprising:
- a socket;
- a flip chip processor positioned on the socket with a flip chip somewhat extending above a top surface of a substrate thereof;
- a heat sink positioned on the flip chip processor, said heat sink including a base having a bottom surface thereof, said bottom surface defining an offset structure thereof and forming a downward protrusion sandwiched between an edge of the substrate of the flip chip processor and a raised portion of the socket for properly positioning the heat sink with respect to the flip chip processor;
- wherein
- a first distance between a top surface of the flip chip and the top surface of the flip chip processor is larger than a second distance between the bottom surface of the base and the top surface of the flip chip processor so as to result in a relatively shorter rotation path pivotal about an edge of the flip chip during installation of the heat sink to the socket.
2 more elements
Dependencies are inferred from the claim text.