Method for estimating yield of integrated circuit device

A method for estimating the yield of an integrated circuit device comprising:

• a step of inputting the number of elements in the integrated circuit device, the chip area of said integrated circuit device, and the defect density in the manufacturing process of said integrated circuit device;
• a step of calculating the element density which is the number of said elements per unit area;
• a step of selecting an estimation equation representing the dependence of the expected yield on the defect density and the chip area;
• a step of correcting the chip area corresponding to said element density calculated in said step;
• a step of substituting said corrected chip area and said defect density into said estimation equation to calculate the expected yield of said integrated circuit device, and
• a step of calculating the mean element density obtained based on the number of elements of an integrated circuit device manufactured in said manufacturing process,
• wherein in said step of correcting the chip area, a correction factor is determined as a function of a value obtained by dividing said element density by said mean element density, and said correction factor is multiplied by the inputted chip area to correct the chip area.

A method for estimating the yield of an integrated circuit device comprising:

• a step of inputting the number of elements in the integrated circuit device, the chip area of said integrated circuit device, and the defect density in the manufacturing process of said integrated circuit device;
• a step of calculating the element density which is the number of said elements per unit area;
• a step of selecting an estimation equation representing the dependence of the expected yield on the defect density and the chip area;
• a step of correcting the chip area corresponding to said element density calculated in said step;
• and
• a step of substituting said corrected chip area and said defect density into said estimation equation to calculate the expected yield of said integrated circuit device,
• wherein in said integrated circuit device, different kinds of circuits are mounted, and in said step of calculating the element density, weighting is performed corresponding to the kind of said circuits to calculate the element density.

A method for estimating the yield of an integrated circuit device comprising:

• a step of inputting the number of elements in the integrated circuit device, the chip area of said integrated circuit device, and the defect density in the manufacturing process of said integrated circuit device;
• a step of calculating the element density which is the number of said elements per unit area;
• a step of selecting an estimation equation representing the dependence of the expected yield on the defect density and the chip area;
• a step of correcting the chip area corresponding to said element density calculated in said step;
• and
• a step of substituting said corrected chip area and said defect density into said estimation equation to calculate the expected yield of said integrated circuit device,
• wherein a plurality of kinds of elements are mounted of which the probabilities of failures given by the same number of defects differ from one another depending on the condition where a wiring layer interconnecting diffusion layers of each element in said integrated circuit device is formed, and
• in said step of calculating the element density, the number of said elements is weighted corresponding to the probability of failures given by defects at the part interconnecting each of said elements and a wire to calculate the element density.