Integrated formation of LDD and non-LDD semiconductor devices
AssigneeAdvanced Micro Devices, Inc.
InventorsMark I. Gardner, Robert Paiz, Thomas E. Spikes, Jr.
Life of this patent
Estimating the term…
Loading patent…
AssigneeAdvanced Micro Devices, Inc.
InventorsMark I. Gardner, Robert Paiz, Thomas E. Spikes, Jr.
Estimating the term…
A method of forming a semiconductor device includes forming a first gate electrode over a substrate and then forming a spacer on at least one sidewall of the first gate electrode. A second gate electrode is formed over the substrate after forming the spacer. A first dopant is implanted into the substrate to form a first heavily doped active region adjacent to the spacer and spaced from the first gate electrode and a second heavily doped active region adjacent to the second gate electrode. The spacer is then removed and a second dopant is implanted into the substrate to form a lightly doped active region adjacent to the first gate electrode. In some instances, gate dielectrics for the first and second gate electrodes are formed using different materials and/or having different thicknesses.
A method of forming a semiconductor device comprising:
A method of forming a semiconductor device comprising:
Dependencies are inferred from the claim text.