US 6,309,902 B1Granted

Method for coating semiconductor element with resin, coating resin, and liquid crystal display device

AssigneeSeiko Epson Corporation

InventorEiji Muramatsu

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Abstract

It is an object of this invention to provide a method for simply and quickly covering a semiconductor device with a coating resin. In the method for covering a semiconductor device 2 used for a liquid crystal panel 1 with a coating resin, a coating resin 14 being formed as a layer, the coating resin 14 is placed around the semiconductor device 2, and the semiconductor device 2 and its surroundings are covered with the coating resin 14 by curing the coating resin 14 so as to be protected from moisture. The coating resin 14 may be a coating resin which is curable through a chemical reaction by heating or an ultraviolet curing type resin or the like. If the coating resin 14 has a through-hole 16 or concavity so as to receive the semiconductor device 2, the position of the coating resin 14 to the semiconductor device 2 can always be set at a fixed position.

Claims37

Dependent claims

A method for providing a liquid crystal display device having a semiconductor device, the method comprising the steps of:

providing a first substrate having a first electrode formed thereon;
providing a second substrate having a second electrode formed thereon;
mounting said second substrate onto said first substrate having a protruded part, said protruded part projecting outwardly relative to said second substrate, wherein said protruded part has a first wire connected to said first electrode, a second wire connected to said second electrode and an input wire formed thereon;
securing said semiconductor device to said protruded part such that said semiconductor device is spaced apart from said second substrate, wherein each of said first wire, said second wire and said input wire connects to said semiconductor device;
forming a discrete coating resin sheet including a through-hole having a certain size which enables said semiconductor device to fit in, wherein said discrete coating resin sheet has length and width dimensions that are substantially the same as said protruded part, and a thickness that is substantially the same as said semiconductor device;
placing said discrete coating resin sheet on said protruded part around said semiconductor device so as to fit said semiconductor device into said through-hole, wherein said discrete coating resin sheet covers each of said first wire, said second wire and said input wire;
and
curing said layer discrete coating resin sheet onto said substrate so as to prevent said semiconductor from being infiltrated with moisture.

5 more elements

A method for providing a liquid crystal display device having a semiconductor device, the method comprising the steps of:

providing a first substrate having a first electrode formed thereon;
providing a second substrate having a second electrode formed thereon;
mounting said second substrate onto said first substrate having a protruded part, said protruded part projecting outwardly relative to said second substrate, wherein said protruded part has a first wire connected to said first electrode, a second wire connected to said second electrode and an input wire formed thereon;
securing said semiconductor device to said protruded part such that said semiconductor device is spaced apart from said second substrate, wherein each of said first wire, said second wire and said input wire connects to said semiconductor device;
forming a discrete coating resin sheet including a through-hole having width and length dimensions that are substantially the same as said semiconductor device, wherein said discrete coating resin sheet has length and width dimensions that are substantially the same as said protruded part and a thickness that is substantially the same as said semiconductor device;
placing said discrete coating resin sheet on said protruded part around said semiconductor device, wherein said discrete coating resin sheet covers each of said first wire, said second wire and said input wire;
heating said discrete coating resin sheet to a temperature in a range of 60° C. to 80° C. for approximately 30 minutes so as to prevent said semiconductor from being infiltrated with moisture;
and
cooling said discrete coating resin sheet at room temperature for approximately 10 minutes.

6 more elements

A method for providing a liquid crystal display device having a semiconductor device, the method comprising the steps of:

providing a first substrate having a first electrode formed thereon;
providing a second substrate having a second electrode formed thereon;
mounting said second substrate onto said first substrate having a protruded part, said protruded part projecting outwardly relative to said second substrate, wherein said protruded part includes a first wire connected to said first electrode, a second wire connected to said second electrode and an input wire formed thereon;
securing said semiconductor device to said protruded part such that said semiconductor device is spaced apart from said second substrate, wherein each of said first wire, said second wire and said input wire connects to said semiconductor device;
forming a discrete coating resin sheet including a through-hole having a certain size which enables said semiconductor to fit in;
placing said discrete coating resin sheet on said protruded part around said semiconductor after said discrete coating resin sheet is formed, wherein said discrete coating resin sheet covers each of said first wire, said second wire and said input wire;
and
curing said discrete coating resin sheet onto said substrate so as to prevent said semiconductor from being infiltrated with moisture.

5 more elements

Dependencies are inferred from the claim text.