Reducing contamination induced scumming, for semiconductor device, by acid treatment
AssigneePhilips Semiconductor, Inc.
InventorsDavid Ziger, Christopher Robinett
Life of this patent
Estimating the term…
Abstract
A semiconductor device is manufactured using an acid treatment process to eliminate the adverse effects of contamination, such as amine-airborne contamination. Consistent with one embodiment of the present invention, the semiconductor device is formed by applying a DUV-type photoresist over the wafer surface, exposing the photoresist to DUV light, treating the exposed photoresist with an acid vapor, and thereafter baking the exposed wafer.
Claims7
For use in the manufacture of a semiconductor device, a method for inhibiting surface contamination, comprising:
- providing a wafer having a wafer surface and a photoresist over at least a selected portion of the wafer surface;
- exposing the photoresist including subjecting the photoresist to DUV light;
- and
- acid treating the exposed photoresist with an HBr acid vapor and thereafter baking the exposed wafer, the HBr acid vapor treatment causing a reaction that retains a photoresist material over said at least a selected portion.
For use in the manufacture of a semiconductor device, method for inhibiting surface contamination,
- providing a wafer having a wafer surface and a photoresist over at least a selected portion of the wafer surface, including coating the wafer with a DUV photoresist;
- exposing the photoresist;
- and
- acid treating the exposed photoresist with an HBr acid vapor and thereafter baking the exposed wafer, the HBr acid vapor treatment causing a reaction that retains a photoresist material over said at least a selected portion.
For use in the manufacture of a semiconductor device, a method for inhibiting amine-related contamination, comprising:
- providing a wafer having a wafer surface and a photoresist thereover;
- exposing the photoresist to DUV light;
- treating the exposed photoresist with an HBr acid vapor and therein providing a treated photoresist over the wafer surface;
- and thereafter baking the exposed wafer.
Dependencies are inferred from the claim text.