Wafer transfer device
AssigneeOlympus Optical Co., Ltd.
InventorsTomoo Kato, Keiji Kimura
Life of this patent
Estimating the term…
Abstract
A wafer transfer apparatus for taking out a wafer from a wafer cassette having grooves on both ends for holding circumferential edges of a plurality of wafers by moving a wafer transfer arm in height directions and back and forth directions relative to the wafer cassette. The apparatus comprises a wafer pushing out mechanism for pushing out a wafer on the back of a wafer inlet/outlet side of the wafer cassette into which the transfer arm is inserted. The wafer pushing out mechanism comprises a pushing pin rotatable when it is in contact with the wafer and a driving mechanism for driving the pushing pin so as to push the wafer from the back of the wafer cassette to the wafer inlet/outlet side.
Claims17
A wafer transfer apparatus for taking out a wafer from a groove of a wafer cassette by moving a wafer taking out arm relative to the wafer cassette, the wafer transfer apparatus comprising:
- three rotatable pushing members;
- wafer pushing out means for bringing at least two of said pushing members into contact with the wafer to be taken out at a rear end portion of the wafer cassette, and pushing out the wafer, thereby releasing engagement between the wafer and the groove of the wafer cassette;
- and
- transfer means for:
- (i) inserting the wafer taking out arm into the wafer cassette after releasing the engagement between the wafer and the groove of the wafer cassette, (ii) attracting the wafer to the arm, and (iii) taking out the wafer from the cassette.
A wafer transfer apparatus for taking out a wafer from a wafer cassette by moving a wafer taking out arm relative to the wafer cassette, wherein the wafer cassette has grooves on both left and right sides thereof for holding circumferential edges of a plurality of wafers and an interval between the right and left grooves at a rear end part of the wafer cassette is narrower than an interval between the right and left grooves at a front end part of the wafer cassette, the wafer transfer apparatus comprising:
- three rollers rotatable about an axis perpendicular to a surface of the wafer to be taken out;
- pushing out means for pushing out the wafer by bringing at least two of the rollers into contact with the wafer at the rear end part of the wafer cassette;
- and
- transfer means for:
- (i) inserting the wafer taking out arm into the wafer cassette after the wafer is pushed, (ii) placing the wafer on the arm, (iii) attracting the wafer, and (iv) taking the wafer out from the cassette.
A wafer apparatus for taking out a wafer from a wafer cassette by moving a wafer taking out arm relative to the wafer cassette, wherein the wafer cassette has grooves on both left and right sides thereof for holding circumferential edges of a plurality of wafers and an interval between the right and left grooves at a rear end part of the wafer cassette is narrower than an interval between the right and left grooves at a front end part of the wafer cassette, the wafer transfer apparatus comprising:
- three rotatable pushing members;
- wafer pushing out means for bringing at least two of said pushing members into contact with the wafer to be taken out at a rear end portion of the wafer cassette, and pushing out the wafer, thereby releasing engagement between the wafer and the right and left grooves of the wafer cassette;
- and
- transfer means for:
- (i) inserting the wafer taking out arm into the wafer cassette after pushing out the wafer, (ii) placing the wafer on the arm, (iii) attracting the wafer, and (iv) taking out the wafer from the cassette.
A wafer transfer apparatus for taking out a wafer from a wafer cassette by moving a wafer taking out arm relative to the wafer cassette, wherein the wafer cassette has grooves on both left and right sides thereof for holding circumferential edges of a plurality of wafers and an interval between the right and left grooves at a rear end part of the wafer cassette is narrower than an interval between the right and left grooves at a front end part of the wafer cassette, the wafer transfer apparatus comprising:
- a pushing member comprising at least one roller rotatable about an axis perpendicular to a surface of the wafer to be taken out;
- pushing out means for pushing out the wafer by bringing the pushing member into contact with the wafer at the rear end part of the wafer cassette;
- and
- transfer means for:
- (i) inserting the wafer taking out arm into the wafer cassette after the wafer is pushed, (ii) placing the wafer on the arm, (iii) attracting the wafer, and (iv) taking the wafer out from the cassette;
- wherein the pushing out means comprises:
- a sub-base on which the pushing member is mounted;
- a base for holding the sub-base via a linear movement guide;
- a spring for forcing the sub-base in a direction toward the base;
- and
- a motor-driven eccentric cam for separating the sub-base from the base against spring force and linearly moving the sub-base toward a side of the wafer cassette.
A wafer apparatus for taking out a wafer from a wafer cassette by moving a wafer taking out arm relative to the wafer cassette, wherein the wafer cassette has grooves on both left and right sides thereof for holding circumferential edges of a plurality of wafers and an interval between the right and left grooves at a rear end part of the wafer cassette is narrower than an interval between the right and left grooves at a front end part of the wafer cassette, the wafer transfer apparatus comprising:
- three rotatable pushing members;
- wafer pushing out means for bringing at least two of said pushing members into contact with the wafer to be taken out at a rear end portion of the wafer cassette, and pushing out the wafer, thereby releasing engagement between the wafer and the right and left grooves of the wafer cassette;
- and
- transfer means for:
- (i) inserting the wafer taking out arm into the wafer cassette after pushing out the wafer, (ii) placing the wafer on the arm, (iii) attracting the wafer, and (iv) taking out the wafer from the cassette;
- wherein the pushing out means comprises:
- a sub-base on which the pushing members is mounted;
- a base for holding the sub-base via a linear movement guide;
- a spring for forcing the sub-base in a direction toward the base;
- and
- a motor-driven eccentric cam for separating the sub-base from the base against spring force and linearly moving the sub-base toward a side of the wafer cassette.
Dependencies are inferred from the claim text.