Millimeter wave module and radio apparatus

A millimeter wave module comprising:

• 1) a first substrate having a face, said first substrate further having:
• a) a first cavity with bottom and side faces;
• b) a conductor on said bottom and side faces of said first cavity;
• c) a connection part on said face of said first substrate and around said first cavity, said connection part being electrically connected with said conductor;
• d) an air layer in said first cavity;
• 2) a second substrate having a face, said second substrate being a dielectric substrate and having:
• e) a microstrip filter having metal patterning on said face of said second substrate;
• and
• f) a connection part connected to said metal patterning;
• said second substrate mounted to said first substrate by connecting the connection part of said first substrate with said connection part connected to said metal patterning, with said metal patterning facing said air layer in said first cavity and covering said first cavity;
• said first substrate comprising:
• a third substrate having at least one through hole;
• a fourth substrate having a number of through holes not greater than a number of through holes on said third substrate;
• and
• a fifth substrate having no through hole at least at an area of said through hole on said fourth substrate, wherein
• said through hole of said third substrate is said first cavity.

A millimeter wave module comprising:

• a multi-layer ceramic substrate including a first ceramic substrate with a rectangular hole bonded to a second ceramic substrate without a hole,
• a plurality of rectangular cavities formed on said multi-layer ceramic substrate, said cavities having bottom and side faces;
• a coplanar waveguide on said multi-layer ceramic substrate;
• metal patterning on said multi-layer ceramic substrate, said metal patterning connected between said cavities by a coplanar waveguide;
• a conductor formed on said bottom and side faces of each of said cavities as a ground plane;
• a first dielectric substrate having a metal patterning of a microstrip filter on a face thereof;
• said metal patterning of said microstrip filter faces and covers one cavity of said plurality of cavities on said multi-layer ceramic substrate;
• and
• an MMIC mounted on said multi-layer ceramic substrate to cover another of said plurality of cavities on said multi-layer ceramic substrate.

A millimeter wave module comprising:

• a multi-layer substrate including a first substrate of BCB (benzocyclobutene) with a rectangular hole bonded to a second substrate of a ceramic without a hole,
• a plurality of rectangular cavities formed on said multi-layer substrate, said cavities having bottom and side faces;
• a coplanar waveguide on said multi-layer substrate;
• metal patterning on said multi-layer substrate, said metal patterning connected between said cavities by a coplanar waveguide;
• a conductor formed on said bottom and side faces of each of said cavities as a ground plane;
• a first dielectric substrate having a metal patterning of a microstrip filter on a face thereof, said metal patterning of said microstrip filter faces and covers one cavity of said plurality of cavities on said multi-layer substrate;
• and
• an MMIC mounted on said multi-layer substrate to cover another of said plurality of cavities on said multi-layer substrate.

A millimeter wave module comprising:

• a multi-layer substrate including a first substrate of polyimide with a rectangular hole bonded to a second substrate of a ceramic without a hole,
• a plurality of rectangular cavities formed on said multi-layer substrate, said cavities having bottom and side faces;
• a coplanar waveguide on said multi-layer substrate;
• metal patterning on said multi-layer substrate, said metal patterning connected between said cavities by a coplanar waveguide;
• a conductor formed on said bottom and side faces of each of said cavities as a ground plane;
• a first dielectric substrate having a metal patterning of a microstrip filter on a face thereof, said metal patterning of said microstrip filter faces and covers one cavity of said plurality of cavities on said multi-layer substrate;
• and
• an MMIC mounted on said multi-layer substrate to cover another of said plurality of cavities on said multi-layer substrate.