Integrated semiconductor chip with modular dummy structures
AssigneeSiemens Aktiengesellschaft
InventorsDominique Savignac, Helmut Schneider
Life of this patent
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Abstract
For an integrated semiconductor chip to operate reliably, it is necessary to homogenize a substrate potential as far as possible in all regions of the chip. In order to improve the substrate contact-connections on the chip, modular dummy structures are configured in such a way that, in addition to homogenizing the areal occupancy of the chip, they form extensive electrically conductive contact between the substrate and metal interconnects of a metallization plane of the chip. This achieves homogenization of the substrate potential and improvement of the wave guiding properties of wiring planes lying above the dummy structures without an additional process step or an additional chip area being required for this purpose.
Claims7
An integrated semiconductor chip, comprising:
- a substrate;
- and
- modular dummy structures disposed on said substrate and include a metallization plane with metal interconnects and a multiplicity of electrically conductive contact points disposed between said metal interconnects of said metallization plane and said substrate in areas of a chip area over which said dummy structures extend;
- said metal interconnects of said metallization plane being electrically conductively connected to said multiplicity of said electrically conductive contact points.
Dependencies are inferred from the claim text.