Perimeter wafer lifting
AssigneeLam Research Corporation
InventorEric H. Lenz
Life of this patent
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Abstract
The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during lifting. The perimeter pin is configured to overcome a holding force at an interface of the substrate and the surface. Generally, the holding force is generated between the substrate and the surface during the processing step. The apparatus further includes a center pin for moving the substrate from the first position to a second position wherein the substrate is disposed on the center pin during moving. The second position is further away from the surface of the chuck than the first position.
Claims34
An apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step, said apparatus comprising:
- a perimeter pin for lifting said substrate from said surface of said chuck to a first position wherein said substrate is disposed on said perimeter pin during said lifting, said perimeter pin being configured to overcome a holding force at an interface of said substrate and said surface, said holding force being generated between said substrate and said surface during said processing step;
- and
- a center pin for moving said substrate from said first position to a second position wherein said substrate is disposed on said center pin during said moving, said second position being further away from said surface of said chuck than said first position.
A substrate processing system, said system comprising:
- a work piece holder, said work piece holder including an arrangement being configured to remove a substrate from a surface of said work piece holder when said substrate is coupled to said surface of said work piece holder by a holding force, said work piece holder including:
- a first pin located proximate to a perimeter of said substrate, and configured to move perpendicular to said surface so as to break said holding force between said substrate and said work piece holder by lifting said substrate from said surface to a first position, said substrate being disposed on said first pin during said lifting;
- and
- a second pin located proximate to a center of said substrate, and configured to move perpendicular to said surface so as to transport said substrate by moving said substrate from said first position to a second position wherein said substrate is disposed on said second pin during said moving, said second position being further away from said surface of said work piece holder than said first position.
An apparatus for moving a wafer relative to a surface of a chuck, the wafer having an inner region and an outer region, said apparatus comprising:
- a perimeter pin movable relative to said chuck, said perimeter pin being configured to move in a linear direction between a first perimeter position, engaging said outer region of said wafer proximate said surface of said chuck, and a second perimeter position, placing said wafer a first predetermined distance away from said surface of said chuck;
- a center pin movable relative to said chuck, said perimeter pin being configured to move between a first center position, engaging said inner region of said wafer proximate said first predetermined distance, and a second center position, placing the wafer a second predetermined distance away from said surface of said chuck.
Dependencies are inferred from the claim text.