Method for fabricating a type of trench mask ROM cell
AssigneeMosel Vitelic, Inc.
InventorKuan-Chou Sung
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AssigneeMosel Vitelic, Inc.
InventorKuan-Chou Sung
Estimating the term…
A method for fabricating a type of Trench Mask ROM cell comprises steps including: providing a substrate doped lightly with p-type dopant, sequentially forming a pad oxide layer and a nitride layer on the substrate; etching back the pad oxide layer, the nitride layer and the substrate to form plural trenches; a gate oxide layer being formed on surfaces of each trench; then, implanting n+-type ions into the substrate beneath the pad oxide layer and between each two adjacent trenches; and, forming a polysilicon layer on the gate oxide and pad oxide; finally, implanting n+-type ions into the substrate beneath the gate oxide layer on bottoms of selected trenches. And, it is appreciated that the sequence of the formation of plural trenches and implanting n+-type ions into substrate between each trench can be reversed in the embodiment without affecting subsequent steps.
A method for fabricating a type of Trench Mask ROM cell on a substrate, wherein said method comprises the steps in the following sequence:
A method for fabricating a type of Trench Mask ROM cell on a substrate, wherein said method comprises the steps in the following sequence:
Dependencies are inferred from the claim text.