Compact phased array antenna system, and a method of operating same

A method of operating an antenna system which includes a thin and generally planar electrical interconnection section and a plurality of antenna elements disposed on one side of and electrically coupled to said interconnection section, comprising the steps of:

• providing on a side of said interconnection section opposite from said antenna elements a module having a circuit board with electronic components thereon;
• orienting said circuit board to extend approximately perpendicular to said interconnection section;
• transmitting electrical signals between said interconnection section and said electronic components;
• and
• transferring heat emitted by said electronic components to a cooling section which is disposed on a side of said module remote from said interconnection section.

An apparatus, comprising:

• an electrical interconnection section which is thin and generally planar;
• an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;
• a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section;
• and
• a module which is disposed between said interconnection section and said cooling section, which has electronic components thereon, which includes a first portion operative to electrically couple said electronic components to said interconnection section, and which includes a second portion operative to transfer to said cooling section the heat emitted by said electronic components;
• wherein said second portion includes a heat transfer member which has portions respectively adjacent said electronic components and said cooling section;
• wherein said module includes a circuit board which extends approximately perpendicular to said interconnection section and has said electronic components thereon;
• and
• wherein said heat transfer member is an L-shaped member having a first leg which is disposed against a portion of said circuit board with said electronic components thereon, and having a second leg which is disposed adjacent a surface portion of said cooling section.

An apparatus, comprising:

• an electrical interconnection section which is thin and generally planar;
• an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;
• a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section;
• and
• a plurality of modules which are each disposed between said interconnection section and said cooling section, which are spaced a substantial distance from each other, which each have electronic circuitry thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon;
• wherein each said module includes a circuit board which extends approximately perpendicular to said interconnection section and has said electronic components thereon;
• and
• wherein each said module includes a heat transfer member which is an L-shaped member having a first leg disposed against a portion of said circuit board with said electronic components thereon, and having a second leg disposed adjacent a surface portion of said cooling section.

An apparatus, comprising:

• an electrical interconnection section which is thin and generally planar;
• an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;
• a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section;
• and
• a plurality of modules which are each disposed between said interconnection section and said cooling section, which are spaced a substantial distance from each other, which each have electronic circuitry thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon;
• wherein each said module includes a circuit board which extends approximately perpendicular to said interconnection section, which has thereon said electronic components of the module, and which has a plurality of electrical conductors electrically coupled to the electronic components;
• wherein each said module includes an arrangement which is cooperable with the circuit board thereof to hermetically seal said electronic components thereon within said module, said arrangement including a frame sealingly coupled to the circuit board and extending around said electronic components thereon, and including a lid sealingly coupled to a side of the frame opposite from the circuit board;
• and
• wherein said first portion of each said module includes said frame therefor having a wall portion that has a plurality of conductors electrically coupled to said interconnection section, and includes conductive elements which each electrically couple a respective one of the conductors of the wall portion thereof to a respective one of the conductors of the circuit board thereof.

An apparatus, comprising:

• an electrical interconnection section which is thin and generally planar;
• an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;
• a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section;
• a plurality of modules which are each disposed between said interconnection section and said cooling section, which are spaced a substantial distance from each other, which each have electronic circuitry thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon;
• and
• an annular housing which extends between and is coupled to each of said interconnection section and said cooling section, each said module being disposed within said housing.