US 6,297,721 B1 · Electronic surface mount package

Abstract

An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.

Claims7

Dependent claims

An electronic surface mount package for mounting onto a printed circuit board comprising:

a one piece construction package having a side wall and an open bottom,
a plurality of toroid transformers within said package, said toroid transformers each having wires wrapped thereon,
a plurality of terminal pins molded within and extending through and below a bottom of said side wall, one end of each of said pins having a notched solder post upon which said wires from said transformers are wrapped and soldered thereon, respectively,
the other end of each of said terminal pins extending in gull wing fashion outwardly from and below the bottom of the side wall for mounting onto the surface of the printed circuit board, and
at least one reinforcement beam located laterally along the bottom of said package to provide improved mechanical strength of said package.

2 more elements

Dependencies are inferred from the claim text.

Electronic surface mount package

Life of this patent

Electronic surface mount package

Life of this patent

Abstract

Claims7