Interconnect and carrier with resistivity measuring contacts for testing semiconductor components

A method for testing a semiconductor component having a plurality of component contacts including a first component contact electrically connected to a second component contact, the method comprising:

• providing a board comprising an electrical connector and a biasing mechanism for retaining the component on the board;
• providing an interconnect on the board comprising a plurality of interconnect contacts in electrical communication with the electrical connector including a first resistivity contact configured to electrically engage the first component contact, a second resistivity contact configured to electrically engage the second terminal contact, and a four terminal Kelvin structure in electrical communication with the first resistivity contact and the second resistivity contact;
• retaining the component on the board with the first resistivity contact electrically engaging the first component contact and the second resistivity contact electrically engaging the second component contact;
• measuring a resistance of an electrical path between the first resistivity contact and the second resistivity contact using the Kelvin structure;
• applying test signals through the electrical connector and the interconnect contacts to the component contacts;
• and
• adjusting the test signals based on the resistance.

A method for testing semiconductor components comprising:

• providing a component comprising a first component contact electrically connected to a second component contact;
• providing a carrier configured to retain the component comprising a base and a plurality of terminal contacts on the base including a first terminal contact and a second terminal contact;
• providing an interconnect on the base comprising a plurality of interconnect contacts in electrical communication with the terminal contacts including a first resistivity contact in electrical communication with the first terminal contact, a second resistivity contact in electrical communication with the second terminal contact and a four terminal Kelvin structure in electrical communication with the first resistivity contact and the second resistivity contact;
• assembling the component in the carrier with the first component contact in electrical communication with the first resistivity contact, and the second component contact in electrical communication with the second resistivity contact;
• applying a test current and a sense current through the Kelvin structure to the first resistivity contact and to the second resistivity contact, to measure a total resistance of an electrical path between the first resistivity contact and the second resistivity contact;
• evaluating the total resistance;
• applying test signal through the terminal contacts and the interconnect contacts to the component contacts;
• and
• controlling the test signals based on the evaluating step.

A method for testing a semiconductor component having a plurality of component contacts including a pair of interconnected contacts, the method comprising:

• providing a test carrier configured to retain the component, the test carrier comprising a base having a plurality of terminal contacts and a force applying mechanism attachable to the base for applying a biasing force to the component;
• providing an interconnect on the base comprising a plurality of interconnect contacts including a pair of resistivity contacts configured to electrically engage the interconnected contacts on the component and a four terminal Kelvin structure in electrical communication with the resistivity contacts and with selected terminal contacts on the base;
• assembling the test carrier with the resistivity contacts in electrical communication with the interconnected component contacts and with the force applying mechanism biasing the component and the interconnect together;
• providing a resistivity measuring circuit in electrical communication with the selected terminal contacts on the base;
• measuring a resistance of an electrical path between the resistivity contacts using the resistivity measuring circuit and the Kelvin structure;
• and
• applying test signals through the terminal contacts and the interconnect contacts to the component contacts provided the resistance is within a selected range.

A carrier for testing a semiconductor component having a plurality of component contacts including a pair of interconnected component contacts comprising:

• a base comprising a plurality of terminal contacts configured for electrical communication with test circuitry;
• an interconnect on the base comprising a plurality of interconnect contacts in electrical communication with the terminal contacts configured to establish temporary electrical connections with the component contacts;
• the interconnect comprising a pair of resistivity contacts configured to electrically engage the interconnected component contacts, and a four terminal Kelvin structure in electrical communication with the pair of resistivity contacts and with selected terminal contacts on the base;
• the pair of resistivity contacts configured to evaluate a resistance of an electrical path therebetween upon application of a sense current and a test current to the selected terminal contacts.

A carrier for testing a semiconductor component having a plurality of component contacts including a pair of interconnected component contacts, the carrier comprising:

• a base comprising a plurality of terminal contacts configured for electrical communication with test circuitry;
• an interconnect on the base comprising a plurality of interconnect contacts configured to electrically engage the component contacts;
• the interconnect contacts including a pair of resistivity contacts configured to electrically engage the interconnected component contacts;
• a four terminal structure on the interconnect in electrical communication with the resistivity contacts and with four terminal contacts on the base;
• the resistivity contacts, the four terminal structure and the four terminal contacts configured to measure a total resistance of an electrical path between the resistivity contacts during electrical engagement of the interconnected component contacts, the total resistance comprising a contact resistance between the resistivity contacts and the interconnected component contacts.

A test system for testing semiconductor components comprising:

• a board comprising an electrical connector configured for electrical communication with test circuitry;
• a plurality of interconnects on the board in electrical communication with the electrical connector and configured to establish temporary electrical connections with a plurality of component contacts on the components;
• each interconnect comprising a first resistivity contact configured to electrically engage a first component contact on a component, a second resistivity contact configured to electrically engage a second component contact on the component in electrical communication with the first component contact, and a four terminal Kelvin structure including two terminals in electrical communication with the first resistivity contact and the electrical connector, and two terminals in electrical communication with the second resistivity contact and the electrical connector;
• and
• a plurality of force applying mechanisms attached to the board configured to bias the components against the interconnects.