US 6,297,643 B2 · Connection test method

Abstract

The invention relates to a method of testing interconnections in integrated circuit (IC) assemblies. Hereto, a test signal is applied to an IC pin (110) providing an input terminal to the interconnection. In known methods, such as the boundary-scan method, a response signal is measured on an output terminal of the interconnection, provided by a further IC pin. According to the invention, however, a response signal is evaluated which is generated on the same terminal (110) as to which the test signal is applied. This has the advantage that the method of the invention can be applied when only one end of the interconnect to be tested can be supplied with appropriate test hardware. The method is particularly suited for testing a capacitance (195) between an IC pin (110) and a supply line, e.g. a ground line.

Claims11

Dependent claims

A method of testing a signal path in a circuit, the method comprising:

applying a test signal to a terminal of the signal path, and
receiving a response signal from the terminal,
comparing the response signal to a predefined parameter to produce a binary signal having a state that is indicative of a fault on the signal line,
providing the binary signal to a boundary-scan cell, to facilitate a detection of the fault on the signal path by shifting the binary signal to an external node via the boundary-scan cell,
wherein
the response signal is dependent upon at least one of a capacitive and an inductive characteristic associated with the signal path.

3 more elements

Dependencies are inferred from the claim text.

Connection test method

Life of this patent

Connection test method

Life of this patent

Abstract

Claims11