Semiconductive chip having a bond pad located on an active device
AssigneeTelefonaktieboalget LM Ericsson (publ)
InventorLars Tilly
Life of this patent
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Abstract
A semiconductive chip having at least one active device, and at least one bond pad located on said active device. The bond pad has at least one deformable member, and the deformable member is deformable when conductive stud is bonded to said bond pad so as to prevent damage to the active device during the bonding of the conductive stud to the bond pad, such as by an ultrasonic bonding technique. A plurality of the deformable members may define a pattern on the bond pad that deforms when the conductive stud is bonded to the bond pad.
Claims15
A semiconductive chip comprising:
- at least one active device;
- and
- at least one bond pad located on said active device, said bond pad having a patterned portion that is deformable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said deformable member comprises a plurality of deformable members, said plurality of deformable members defining a pattern.
A semiconductive chip comprising:
- at least one active device;
- and
- at least one bond pad located on said active device, said bond pad having a patterned portion that is deformiable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said deformable member is one of a plurality of deformable members, said deformable members each protruding from a common surface of said bond pad a same distance.
A semiconductive chip comprising:
- at least one active device;
- and
- at least one bond pad located on said active device, said bond pad having a patterned portion that is deformable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said patterned portion includes a plurality of deformable members each protruding from a surface of said bond pad and being spaced from each other by a gap.
A semiconductive chip comprising.
- at least one active device;
- and
- at least one bond pad located on said active device, said bond pad having a patterned portion that is deformable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said patterned portion includes a criss-cross pattern defined by a plurality of deformable members.
Dependencies are inferred from the claim text.