Structure, materials, and applications of ball grid array interconnections

A structure comprising:

• a plurality of electrically conducting spheres disposed in an array on an electronic chip carrier module;
• said spheres being electrically and mechanically joined to terminal pads on the module by means of an electrically conducting adhesive;
• said spheres being electrically and mechanically joined to terminal pads on a printed circuit board by means of another electrically conducting adhesive;
• and wherein the said electrically conducting adhesive comprises:
• a thermoplastic or thermosetting polymer resin matrix,
• no-clean solder flux,
• a plurality of electrically conducting particles with an electrically conductive and fusible coating with at least some of said particles being fused to other said particles through said electrically conductive fusible coating.

A structure comprising:

• a plurality of electrically conducting spheres disposed in an array on an electronic chip carrier module;
• said spheres being electrically and mechanically joined to terminal pads on the module by means of an electrically conducting adhesive;
• said spheres being electrically and mechanically joined to terminal pads on a printed circuit board by means of another electrically conducting adhesive;
• said electronic chip carrier module being electrically connected to an integrated circuit device by an array of conductive bumps made of an electrically conducting adhesive, and wherein the said electrically conducting adhesive is a mixture comprising:
• a thermoplastic or thermosetting polymer resin matrix,
• no-clean solder flux,
• a plurality of electrically conducting particles with an electrically conductive and fusible coating with at least some of said particles being fused to other said particles through said electrically conductive fusible coating.