US 6,297,493 B1Granted

Photoelectric converter with a plurality of photoelectric conversion layers deposited in a predetermined orientation relative to one another

AssigneeCanon Kabushiki Kaisha

InventorsIsao Kobayashi, Noriyuki Kaifu, Shinichi Takeda, Kazuaki Tashiro, Tadao Endo, Toshio Kameshima

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Abstract

A photoelectric converter includes a plurality of substrates, which are located adjacent to each other and on which a plurality of photoelectric conversion devices are two-dimensionally arranged, either scan circuits or detection circuits, at least, that are arranged on two opposing sides of the photoelectric converter, whereby scanning directions either from the scan circuits or from the detection circuits, which are arranged on the two opposing sides, are capable of being set so as to be performed in like directions.

Claims5

Dependent claims

A method of manufacturing a photoelectric converter formed by arranging and bonding together a plurality of substrates each including a plurality of photoelectric conversion devices in two-dimensional array, so that photoelectric conversion device sections thereof abut each other side by side on a plane, comprising steps of:

arranging the plurality of substrates on a plane on a surface of a common jig within a common CVD apparatus, and depositing on each of the substrates, a semiconductor layer for use in forming the photoelectric conversion device sections;
and
bonding on a mother board the plurality of substrates on which the semiconductor layer is deposited, such that said plurality of substrates are respectively deposited in a same orientation as an orientation of the substrates arranged at the deposition step.

Dependencies are inferred from the claim text.

Facts

Application: 09/310,122Filed 12 May 1999 · division
Priority: JP 7-2278515 Sep 1995
Granted: 2 Oct 2001
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

H04N 25/41
Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled:…
H04N 23/30
Cameras or camera modules comprising electronic image sensors; Control thereof: for generating image signals from X-rays
H10F 39/107
Integrated devices: having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays
H10F 39/18
Image sensors: complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

Family

Application08/708,490Parent of this division · filed 5 Sep 1996
US 5,914,485 AParent of this division
US 6,297,493 B1This patent

From the US filing history. Foreign family members aren’t listed.

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