Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range
AssigneeSiemens Aktiengesellschaft
InventorsKlaus Höhn, Heiner Bayer
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AssigneeSiemens Aktiengesellschaft
InventorsKlaus Höhn, Heiner Bayer
Estimating the term…
A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.
A single-component adhesive system thermally hardenable by a cationic mechanism comprising:
A single-component adhesive system thermally hardenable by a cationic mechanism comprising:
A method for forming precision glued bonds with dimensional tolerances in the micrometer and sub-micrometer region, the method comprising the steps of:
Dependencies are inferred from the claim text.