Semiconductor encapsulating epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsShoichi Osada, Takayuki Aoki, Toshio Shiobara, Kazutoshi Tomiyoshi, Eiichi Asano
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Abstract
An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
Claims9
A semiconductor encapsulating epoxy resin composition free from halogenated epoxy resins, antimony trioxide, and aluminum hydroxide, said resin comprising
- (A) an epoxy resin of the following general formula (1):
- wherein R1 which may be the same or different is a hydrogen atom, an alkyl group of 1 to 4 carbons atoms, or a phenyl group, and n is an integer of 0 to 10,
- (B) a phenolic resin curing agent of the following general formula (2):
- wherein R2 which may be the same or different is a hydrogen atom, an alkyl group of 1 to 4 carbons atoms, or a phenyl group, and m is an integer of 0 to 10,
- (C) a molybdenum compound, and
- (D) an inorganic filler.
Dependencies are inferred from the claim text.