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US 6,297,294 B1Granted
Method for improving the adhesion of a photopolymerizable composition to copper
AssigneeE. I. Du Pont de Nemours and Company
InventorKenneth Isaac Lazaar
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Abstract
A method of increasing the adhesion of a photopolymerizable composition and the photopolymerized composition formed therefrom, which method comprises the step of adding an adhesion promoter, which consists essentially of a polycarboxylic acid having three to six carbon atoms, to the photopolymerizable composition.
Claims7
A method for increasing the adhesion of a photopolymerizable composition and the photopolymerized composition formed therefrom to a copper substrate,
- said substrate presenting at least one surface,
- said photopolymerizable composition being adapted for application to said at least one surface for photopolymerizing thereon and comprising (a) a photoinitator system;
- (b) a nongaseous, ethylenically unsaturated monomer or oligomer;
- and (c) a preformed macromolecular binder,
- said method comprising the step of adding to said photopolymerizable composition 0.01 to 1.0 percent, by weight, of an adhesion promoter, based upon the total weight of the photopolymerizable composition;
- said adhesion promoter consisting essentially of a aliphatic poly-carboxylic acid having 3-6 carbon atoms.
3 more elements
Dependencies are inferred from the claim text.