US 6,297,077 B1 · Process for manufacturing chip cards, device for the implementation of this process and chip card

Abstract

The invention comprises a chip card, a process for making the chip card, and an injection molding device for the implementation of the process, wherein a mold in the injection molding device includes a minimum of one mold space and mold parts which are movable in relation to each other, whereby: a first injection nozzle is provided for injecting a first plastic material into a first mold compartment in the mold space; a second injection nozzle is provided for injecting a second plastic material into a second mold compartment in the mold space, and; in a preferred embodiment, the first injection nozzle is positioned vertically to the second injection nozzle.

Claims22

Dependent claims

A process to manufacture a chip card by injecting a molten plastic material into a mold and subsequently cooling down the plastic material, comprising the steps of:

injecting a first plastic material into a first mold compartment while a second mold compartment is closed off with a slide gate;
moving the slide gate that closes off the second mold compartment from the first mold compartment out of the mold space;
and
while maintaining the mold and the injected first plastic material stationary, injecting a second plastic material into the second mold compartment.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

09/135,403Filed 18 Aug 1998

Priority

DE 197 36 08220 Aug 1997

Granted

2 Oct 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

G06K 19/07724
Physical layout of the record carrier: the record carrier being at least partially made by a molding process
B29C 45/14647
For obtaining an insulating effect, e.g. for electrical components: making flat card-like articles with an incorporated IC or chip module, e.g. IC…
B29C 45/1635
Making multilayered or multicoloured articles: using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
G06K 19/07745
Constructional details, e.g. mounting of circuits in the carrier: mounting details of integrated circuit chips

Process for manufacturing chip cards, device for the implementation of this process and chip card

Life of this patent

Process for manufacturing chip cards, device for the implementation of this process and chip card

Life of this patent

Abstract

Claims22