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US 6,296,555 B1Granted
Wafer machining apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorsTakao Inaba, Minoru Numoto
Life of this patent
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Abstract
According to the present invention, a floating mechanism of a load stage floats positioned wafers in concave parts, and then, the chucks hold the wafers by suction. Therefore, the chucks can easily hold the centered wafers.
Claims4
A wafer polishing apparatus comprising:
- a polishing part for polishing a wafer;
- an aligner for centering an unpolished wafer;
- a load stage which has a concave part for holding a wafer that has been centered by the aligner;
- transporting means for transporting the wafer from said aligner to the concave part of said load stage;
- floating means provided in said concave part for floatable supporting the wafer held thereby;
- and
- a wafer holding part for holding the wafer by suction and for removing the wafer floatable supported in the concave part from said load stage and transferring the wafer to said polishing part.
4 more elements
Dependencies are inferred from the claim text.