Land grid package connector
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsJwomin Wang, Nick Lin, Justin Yu
Life of this patent
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AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsJwomin Wang, Nick Lin, Justin Yu
Estimating the term…
An LGP connector comprises an insulative housing and a plurality of contacts. The housing defines a plurality of passageway sections for receiving the contacts therein. Each contact includes a soldering base for soldering the contact to a printed circuit board and an upper contact beam for electrically connecting the contact with an LGP chip, thereby electrically connecting the chip with the printed circuit board. Each contact comprises a pair of anti-rotation tabs extending from an end of the soldering base, and each passageway section transversely defines an anti-rotation cavity in a bottom face thereof and at a first side wall thereof for retaining the anti-rotation tabs of the contact.
A Land-Grid-Package (LGP) connector for connecting an LGP chip with a printed circuit board, comprising:
Dependencies are inferred from the claim text.