Heat sink assembly

An electronics assembly, comprising:

• an electronics module comprising electronic components mounted on a support;
• a fin structure having a contact portion contacting a bottom surface of the support and fins extending from the contact portion;
• and
• means to apply load to the contact portion of the fin structure such that the contact portion directly contacts the bottom surface of the support, wherein the means to apply load to the contact portion of the fin structure comprises a curvature defined in the contact portion that is curved away from the bottom surface of the support.

An electronics assembly, comprising:

• an electronics module comprising electronic components mounted on a support;
• a fin structure having a contact portion contacting a bottom surface of the support and fins extending from the contact portion;
• and
• means to apply load to the contact portion of the fin structure such that the contact portion directly contacts the bottom surface of the support, wherein the means to apply load to the contact portion of the fin structure comprises a hollow base coupled to the fin structure and the support and a means for coupling the base to the fin structure, the hollow base comprising:
• a horizontal surface applying load to the contact portions of the fin structure;
• and
• slots through which the fins of the fin structure extend.

An RF power amplifier assembly, comprising:

• a housing;
• at least one amplifier disposed within the housing;
• a pallet composed of a thermally conductive material coupled to a bottom of the amplifier;
• a fin structure attached to the pallet, the fin structure having contact portions that are in direct contact with a lower surface of the pallet and fins extending from the contact portions;
• and
• a base supporting the fin structure and having an air flow path therethrough and one or more apertures through which the fins extend into the air flow path.