Method for reducing damage to wafer cutting blades during wafer dicing
AssigneeMicron Technology, Inc.
InventorsJames M. Wark, Salman Akram
Life of this patent
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Abstract
A method of forming a support for supporting the underside of a semiconductor wafer having a circuit side, an underside, and a street index that defines dice on the semiconductor wafer, at least during dicing of the semiconductor wafer, is provided. The method includes providing a support having a surface for supporting the underside of the semiconductor wafer and forming at least one recess in the surface corresponding to the street index of the semiconductor wafer.
Claims20
A method of forming a support for a semiconductor wafer at least during dicing of the semiconductor wafer, wherein the semiconductor wafer has a circuit side, an underside, and a street index that defines dice on the semiconductor wafer, comprising:
- providing a support having a surface for supporting the underside of the semiconductor wafer;
- and
- forming at least one recess in the surface corresponding to the street index of the semiconductor wafer.
A method of forming a support for supporting the underside of a semiconductor wafer during dicing of the semiconductor wafer, wherein the semiconductor wafer has a circuit side, an underside, and a street index that defines dice on the semiconductor wafer, comprising:
- providing a support having a surface for supporting the underside of the semiconductor wafer;
- forming a plurality of recesses, having a width at least as wide as a cutting blade utilized for dicing the wafer, in the surface, wherein the recesses correspond to the street index of the semiconductor wafer;
- placing an adhesive intermediate the support and the semiconductor wafer;
- forming a port through the support in fluid communication with the recess;
- and
- applying a negative pressure to the port.
Dependencies are inferred from the claim text.