Method of manufacturing an integrated circuit

A method for manufacturing an integrated RTC IC package, the method comprising the steps of:

• providing a printed circuit board (PCB);
• soldering at least one capacitor soldered on the PCB with soldering points;
• soldering a quartz oscillator soldered on the PCB with soldering points;
• examining the soldering points to identify defective soldering points;
• reworking the defective soldering points until the defective soldering points pass the examination;
• providing a real time clock integrated circuit (RTC IC), wherein a plurality of pins of the RTC IC are bent upward and the RTC IC pins are rectified;
• soldering the PCB on a surface of the RTC IC with soldering points;
• providing a battery soldered on the PCB with soldering points;
• examining the soldering points and measuring a battery voltage;
• re-soldering the soldering points if the soldering point fails to pass the examination;
• replacing the battery if the battery voltage is abnormal;
• charging the battery;
• measuring a signal frequency from the RTC IC and the battery voltage to identify abnormalities;
• fixing up the abnormalities until the signal frequency from the RTC IC and the battery voltage are both correct;
• providing a packaging cover and a gluing material;
• filling the gluing material into the packaging cover;
• assembling the packaging cover filled with the gluing material and the RTC IC soldered with related components to produce the integrated RTC IC package;
• and
• drying out the integrated RTC IC package naturally.