Equipment for brushing the underside of a semiconductor wafer

An equipment for brushing an underside of a semiconductor wafer, the equipment comprising:

• a rotary wafer chuck for positioning the semiconductor wafer;
• a brush rod;
• a brush module mounted at an end point of the brush rod for spraying the underside of the semiconductor wafer with water, the brush module comprising a base, an opening positioned at a bottom of the base for introducing water into the base, a cylinder mechanism installed in a middle of the base and being raised by water when water flows into the base, a brush with a channel mounted on top of the cylinder mechanism, a nozzle mounted on the brush for spraying water from the channel of the brush onto the underside of the semiconductor wafer, and a blade mounted inside the cylinder mechanism, is the blade rotated together with the brush when water flows through the blade;
• and
• a driving device connected to the brush rod for driving the brush rod to in a reciprocating motion;
• wherein when the wafer chuck rotates the semiconductor wafer, the brush module sprays the underside of the semiconductor wafer with water and the driving device drives the brush module to brush the underside of the semiconductor wafer along a radial direction of the semiconductor wafer.