Method of manufacturing card-type storage device and card-type storage device

A method of manufacturing a card-type storage device comprising the steps of:

• preparing a card-type support frame member having an opening, the opening comprising a recess and a through hole formed at the bottom of the recess, wherein the through hole is smaller than the recess;
• preparing a sheet material;
• bonding a bottom surface of the support frame member onto the sheet material;
• cutting the sheet material along the support frame member to form a frame made of the support frame member, the cut sheet material serving as a support sheet attached to the bottom surface of the support frame member;
• and
• fixing an end portion of a circuit board configured as a part of a memory module in the recess of the opening, the memory module having at least one semiconductor memory electrically connected to the circuit board.

A method of manufacturing card-type storage devices comprising the steps of:

• preparing, from resin, a frame member set made of consecutively joined card-type support frame members, each of the consecutively joined card-type support frame members having an opening, each opening comprising a recess and a through hole formed at the bottom of the recess, wherein the through hole is smaller than the recess;
• preparing a sheet material having a size substantially equal to or larger than a size of the frame member set;
• bonding a bottom surface of the frame member set onto the sheet material;
• cutting the frame member set along the support frame members to form a plurality of frames, each one of the plurality of frames being made of the support frame member and the cut sheet material serving as a support sheet attached to the bottom surface of the support frame member;
• and
• fixing an end portion of a circuit board configured as a part of a memory module in the recess of each opening, the memory module having at least one semiconductor memory electrically connected to the circuit board sealed therein on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module.

A method of manufacturing a card-type storage device, including a card-type support frame member made of resin, a support sheet bonded to a bottom surface of the support frame member, and a memory module, the method comprising the steps of:

• preparing the support frame member and a sheet material, the support frame member having an opening, the opening comprising a recess and a through hole formed at the bottom of the recess, wherein the through hole is smaller than the recess;
• cutting the sheet material into the size of the support frame member to form the support sheet;
• bonding the support sheet to the bottom surface of the support frame member to form a frame;
• and
• fixing an end portion of a circuit board configured as a part of the memory module in the recess of the opening of the support frame member in the frame, the memory module having at least one semiconductor memory electrically connected to the circuit board.

A card-type storage device, comprising:

• a card-type support frame member made of one of a transparent and translucent material, the support frame member having an opening, the opening comprising a recess and a through hole formed at the bottom of the recess, wherein the through hole is smaller than the recess;
• a support sheet bonded to a bottom surface of the support frame member;
• and
• a memory module having at least one semiconductor memory sealed therein on a first surface of the memory module, a circuit board, and a flat external terminal exposed on a second surface of the memory module, the card-type storage device being manufactured by the steps of:
• preparing the support frame member and a sheet material;
• cutting the sheet material into the size of the support frame member to form the support sheet;
• bonding the support sheet to the bottom surface of the support frame member to form a frame;
• and
• fixing an end portion of the circuit board in the recess of the opening of the support frame member in the frame.

A method of manufacturing a card-type storage device, comprising the steps of:

• preparing a card-type support frame member having an opening which is formed convexly in a downward direction;
• preparing a sheet material;
• cutting the sheet material into the size of the support frame member to form a support sheet;
• bonding the support sheet to a bottom surface of the support frame member to form a frame;
• and
• fixing an end portion of a circuit board configured as a part of a memory module in a step of the opening of the support frame member in the frame, the memory module having at least one semiconductor memory electrically connected to the circuit board, the sheet material and the semiconductor memory being not contacted therein.