Carrier assembly and method
AssigneeMotorola, Inc.
InventorDetlef Schmidt
Life of this patent
Estimating the term…
Abstract
A carrier assembly (10) for a circuit board includes a copper insert (12) pressed into an aluminum carrier (14). The copper insert has an undercut recess (36). As the insert (12) is pressed into the carrier (14), a portion of the carrier material is flowed into the undercut recess (36) to provide a firm interlocking of the insert (12) with the carrier (14).
Claims24
A carrier assembly comprising:
- an insert of the assembly of a first material able to dissipate heat from a circuit board;
- and
- a carrier plate of the assembly of a second material different from the first material with the first material having enhanced heat dissipating characteristics over the second material,
- wherein the insert is joined to the carrier plate and the joined insert and carrier plate are attached to the circuit board so that the insert is aligned with a heat generating location of the circuit board where heat dissipation is most needed, and
- wherein the carrier plate includes an opening of a predetermined size, and the insert includes an overhang portion having a predetermined configuration so that with the insert aligned with the opening the overhang portion will engage the carrier plate about the opening and the insert will not fall therethrough, and upon exerting a force on the insert in the direction of the carrier plate, the overhang portion will extrude the carrier plate material therebelow into a recess formed thereunder to form a tight joint between the insert and carrier plate.
A carrier assembly for a high power radio frequency circuit board and for providing heat sink therefor, the carrier assembly comprising:
- a carrier made of one or more metallic materials and having at least one internal wall defining an aperture of predetermined size;
- an insert made of one or more metal materials, and having opposed top and bottom walls and an outer peripheral portion adjacent the top wall, the top wall having a size slightly larger than that of the carrier aperture, and the bottom wall having a smaller size than the top wall;
- and
- said insert pressed into said carrier such that a portion of the carrier material adjacent the internal wall is flowed into the undercut recess of the insert to thereby interlock the insert and carrier together.
A method of making a carrier assembly for supporting a high power radio frequency circuit board and providing heat sink therefor, the method comprising:
- providing a carrier made of one or more metallic materials;
- forming an internal wall within said carrier which defines an aperture of predetermined size extending through said carrier;
- providing an insert made of one or more metallic materials, and having top and bottom walls and an outer peripheral portion adjacent the top wall;
- dimensioning the top wall to have a size larger than that of the carrier aperture;
- dimensioning the bottom wall of the insert to have a smaller size than that of the insert top wall;
- forming the insert outer peripheral portion with an undercut recess;
- aligning the insert with the carrier aperture;
- and
- pressing the insert into the carrier aperture so as to flow a portion of the carrier adjacent the carrier internal wall into the undercut recess of the insert to thereby interlock the insert and carrier together.
Dependencies are inferred from the claim text.