Back to results
US 6,295,199 B1Granted
Electronics module and a method of manufacturing such a module
AssigneeSagem SA
InventorJean-Yves Le Gouil
Life of this patent
Estimating the term…
Abstract
The module has a metal substrate having one major face that is insulated and that carries electrical connection tracks, and at least one power component fixed to the substrate and having connection tabs (20) that are soldered to the tracks. The power component is fixed on the non-insulated face and it is placed in a housing constituting an inside wall of a cooling fluid circuit, or it is stuck thereto. The tabs of the component pass through the substrate via holes therein.
Claims12
An electronics module comprising:
- a metal substrate having a major face that has an insulating layer thereon and that carries a plurality of electrical connection tracks and a non-insulated major face, and
- at least one power component fixed on the non-insulated major face of the substrate and having connection tabs which pass through the substrate via holes therein and are electrically insulated from said substrate, said tabs being soldered to respective ones of said tracks, and
- a housing bonded to an inside wall of a cooling fluid circuit, said component being located inside said housing and in close contact therewith.
An electronics module comprising
- a metal substrate having a major face that has an insulating layer thereon and that carries a plurality of electrical connection tracks for connection with electronic components carried by said insulated major face and a non-insulated major face, and
- at least one power component fixed on the non-insulated face of the substrate and having connection tabs which pass through the substrate via holes therein and are electrically insulated from said substrate, said tabs being soldered to respective ones of said tracks, and
- a housing constituting part of an inside wall of a cooling fluid circuit, said component being located inside said housing and in close contact therewith.
Dependencies are inferred from the claim text.