Methods for making integrated micro-optical systems
AssigneeDigital Optics Corporation
InventorsMichael R. Feldman, Alan D. Kathman, William Hudson Welch
Life of this patent
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Abstract
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.
Claims19
A method of making an integrated micro-optical system comprising:
- bonding more than one wafer bonded together, each wafer having a top surface and a bottom surface,
- dicing bonded wafers to yield multiple dies;
- and
- integrating an active element having a characteristic which changes in response to an applied field, on a bottom surface of the die, optical elements being formed on more than one surface of said die.
A method for forming an integrated micro-optical apparatus comprising:
- bonding more than one wafer bonded together, each wafer having a top surface and a bottom surface;
- dicing bonded wafers to yield multiple die;
- and
- before said dicing, forming at least two optical elements on respective surfaces of each resultant die, at least one of said at least two optical elements being a refractive element, a resulting optical system of each die having a high numerical aperture.
Dependencies are inferred from the claim text.