US 6,294,971 B1Granted

Inverted board mounted electromechanical device

AssigneeKearney-National, Inc.

InventorMark E. Martich

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Abstract

A new board mounted electromechanical device is provided that mounts to a relay substrate to form a low profile reed relay. The reed relay is electrically connected to the electrical contacts via a signal traces and additional electrical traces located on the same side of the relay substrate which connect to the relay's signal and shielding. Additional traces on both sides of the signal traces of the reed relay provide a co-planar wave guide to maintain the desired impedance of the signal path. The reed relay is mounted in an inverted manner into a cut-out in the main circuit board so that the other portion of the reed relay itself is sits within the cut-out in the main circuit board. As a result, the reed relay component is recessed below the surface of the main circuit board resulting in an overall low profile circuit board.

Claims9

Dependent claims

A reed device package, comprising:

a reed switch having a main body with first and second electrical signal terminals emanating from opposing sides thereof;
a ground shield surrounding said main body of said reed switch;
a first ground terminal connected to said ground shield;
a second ground terminal connected to said ground shield;
said first electrical signal terminal being positioned between said first ground terminal and said second ground terminal;
a support substrate with a top surface and a bottom surface;
said support substrate defining an seat aperture therethrough;
said reed switch device being affixed to said bottom surface of said support substrate with said main body of said reed switch residing at least partially within said seat aperture;
a first electrical interconnection member on said bottom surface of said support substrate;
said first electrical interconnection member being electrically connected to said first ground terminal;
a second electrical interconnection member on said bottom surface of said support substrate;
said second electrical interconnection member being electrically connected to said second ground terminal;
and
a signal electrical interconnection member on said bottom surface of said support substrate;
said signal electrical interconnection member being electrically connected to said first signal terminal.

12 more elements

A reed device package, comprising:

a reed switch having a main body with a first electrical signal terminal and a second electrical signal terminal emanating from opposing sides thereof;
a ground shield, having a first end and a second end, surrounding said main body of said reed switch;
a first pair of ground terminals connected to said first end of said ground shield;
said first electrical signal terminal positioned between said first pair of ground terminals;
a second pair of ground terminals connected to said second end of said ground shield;
said second electrical signal terminal positioned between said second pair of ground terminals;
a support substrate with a top surface and a bottom surface;
said support substrate defining an seat aperture therethrough;
said reed switch device being affixed to said bottom surface of said support substrate with said main body of said reed switch residing at least partially within said seat aperture;
a first pair of ground electrical interconnection members on said bottom surface of said support substrate;
said first pair of said ground electrical interconnection members being electrically connected to said first pair of ground terminals;
a second pair of ground electrical interconnection members on said bottom surface of said support substrate;
said second pair of said ground electrical interconnection members being electrically connected to said second pair of ground terminals;
a first signal electrical interconnection member on said bottom surface of said support substrate;
said first signal electrical interconnection member being electrically connected to said first electrical signal terminal;
and
a second signal electrical interconnection member on said bottom surface of said support substrate;
said second signal electrical interconnection member being electrically connected to said second electrical signal terminal.

15 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/833,867Filed 12 Apr 2001 · us provisional application
Priority: 21 Jul 2000
Granted: 25 Sep 2001
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 1/141
Structural association of two or more printed circuits: one or more single auxiliary printed circuits mounted on a main printed circuit, e.g.…
H01H 51/281
Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic…:…
H01H 1/5805
Electric connections to or between contacts; Terminals: connections to printed circuits
H01H 2001/5888
Electric connections to or between contacts; Terminals: terminals of surface mounted devices [SMD]

Family

Application60/219,817Us provisional application · filed 21 Jul 2000
US 6,294,971 B1This patent

From the US filing history. Foreign family members aren’t listed.

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