Test mounting for surface mount device packages
OwnerWayne K. Pfaffinventor
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OwnerWayne K. Pfaffinventor
Estimating the term…
A test mounting for LGA packages uses curved contact fingers to make electrical contact between lands on the LGA package and surface mount circuitry on a circuit board or the like. The mounting includes a guide member with guide apertures therein spaced from a support base with corresponding guide apertures. A bending plate positioned between the guide plate and the support base is moved laterally with respect thereto to increase or decrease the distance between the ends of each contact finger and thereby connect or disconnect the ends of the contact fingers with an LGA package mounted adjacent the guide plate and circuit pads on a circuit board on which the test mounting is mounted.
Apparatus for mounting an LGA package having a plurality of terminal lands or leads with surfaces extending in a plane substantially parallel with one face of the LGA package comprising:
Mounting apparatus for an LGA package comprising:
The method of establishing electrical contact between terminal lands on an LGA package and circuit pads on a circuit board or the like comprising the steps of:
Dependencies are inferred from the claim text.