Multi-chip stacked package
AssigneeUtron Technology Inc.
InventorGentle Peng
Life of this patent
Estimating the term…
Abstract
Two IC chips in a multiple-chip module are stacked together on a common lead frame or substrate of a ball-grid array package to save space. The top chip is wire-bonded to the lead frame. The bottom chip is flip-chip bonded to the lead frame, thus allowing more leads. The common substrate of the two chips are connected together by a conductive layer of metal plate, solder or conductive epoxy. The connecting layer may serve as a heat sinking element or a common electrical terminal.
Claims4
A multiple-chip stacked package, comprising:
- an insulating substrate;
- a first integrated circuit (IC) chip having terminals coupled to said substrate by flip-chip;
- a second IC chip stacked over said first IC chip and having terminals coupled to said substrate by wire bonding;
- and
- a metal plate placed between said first IC chip and said second IC chip and supported by four legs.
A multiple-chip stacked package comprising:
- an insulating substrate;
- a first integrated circuit (IC) chip having terminals coupled to said substrate by flip chip;
- a second IC chip stacked over said first IC chip and having terminals coupled to said substrate by wire bonding;
- and
- a metal plate placed between said first IC chip and said second IC chip and supported by two walls.
A multiple-chip stacked package comprising:
- an insulating substrate;
- a first integrated circuit (IC) chip having terminals coupled to said substrate by flip chip;
- a second IC chip stacked over said first IC chip and having terminals coupled to said substrate by wire-bonding;
- and
- a metal plate placed between said first IC chip and said second IC chip and supported by three walls.
A multiple-chip stacked package comprising:
- an insulating substrate;
- a first integrated circuit (IC) chip having terminals coupled to said substrate by flip-chip;
- a second IC chip stacked over said first IC chip and having terminals coupled to said substrate by wire-bonding;
- and
- a metal plate placed between said first IC chip and said second IC chip and supported by four walls.
Dependencies are inferred from the claim text.