Asymmetrical mold of multiple-part matrixes
AssigneeMicron Technology, Inc.
InventorsTodd O. Bolken, Mark S. Johnson
Life of this patent
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Abstract
The present invention relates to a method and system of encapsulating a plurality of chip and board pre-assemblies. Each pre-assembly has first and second surfaces. The method includes positioning a first mold half in a sealing relationship with each first surface of the pre-assemblies and positioning a second mold half adjacent each second surface of the pre-assemblies. The first mold half is filled first thereby forceing each second surface of the pre-assemblies into a sealing engagement with the second mold half. The second molding section is then filled, to result in an asymmetrically overmolded chip and board assembly.
Claims22
A multiple-part matrix asymmetrical encapsulation mold system comprising:
- a plurality of n first unisolated depressions located in a first mold half wherein each first unisolated depression is connected to at least one runner channel;
- a primary plurality of n first isolated depressions located in a second mold half, wherein the primary plurality of n first isolated depressions are smaller in surface area than that of the plurality of n first unisolated depressions located in the first mold half.
A multiple-part matrix asymmetrical encapsulation tooling system comprising:
- a plurality of n first unisolated depressions located in a first mold half, wherein each first unisolated depression is connected to at least one runner channel;
- a primary plurality of n first isolated depressions located in a second mold half, wherein the primary plurality of n first isolated depressions are smaller in surface area than that of the plurality of n first unisolated depressions located in the first mold half;
- and
- up to n electrical devices and n corresponding substrate pre-assemblies comprising a substrate and an electrical device, wherein each substrate pre-assembly is disposed between one of the first unisolated depressions and a corresponding one of the first isolated depressions.
A multiple-part matrix encapsulation tooling comprising:
- a first mold half, the first mold half having a plurality of unisolated depressions therein, each being in flow communication with at least one other unisolated depression through at least one of a runner channel or a header channel.
Dependencies are inferred from the claim text.