GaAs single crystal as well as method of producing the same, and semiconductor device utilizing the GaAs single crystal
AssigneeHitachi, Ltd.
InventorsYoshihisa Fujisaki, Yukio Takano, Tsutomu Ishiba
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AssigneeHitachi, Ltd.
InventorsYoshihisa Fujisaki, Yukio Takano, Tsutomu Ishiba
Estimating the term…
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer is reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements inthe wafer. The difference between the maximum value and minimum value of the lattice distortions of a GaAs single crystal at a normal temperature is set to at most 4×10−5, and the density of Si atoms contained in the GaAs single crystal is set to at most 1×1016 cm−3, whereby the characteristics of semiconductor elements whose parent matrial is the GaAs single crystal can be made uniform.
A semiconductor device comprising a plurality of field effect transistors formed on a surface of a GaAs single crystal substrate,
Dependencies are inferred from the claim text.