Clad polymer EMI shield
AssigneeLaird Technologies, Inc.
InventorJoseph J. Kaplo
Life of this patent
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Abstract
An electromagnetic interference shield for use around access panels and doors in electronic equipment enclosures includes a base and profile manufactured from an electrically nonconductive solid material such as a thermoplastic resin polymer. An electrically conductive layer of a metallized fabric is bonded to the profile to provide effective shielding and grounding functions. The underlying polymer provides elastic compliancy and resiliency to the shield.
Claims7
A shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body, the shield comprising:
- a base for securing the shield to the first body;
- a profile of an electrically nonconductive solid material attached to the base for contacting the second body, wherein the profile comprises a plurality of independently flexible cantilevered fingers forming slits therebetween from a distal end of the profile to proximate the base;
- and
- an electrically conductive layer comprising a metallized fabric disposed on the profile, wherein the metallized fabric comprises a metal coating disposed on a fabric backing.
Dependencies are inferred from the claim text.