Method of manufacturing a semiconductor device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
Estimating the term…
To efficiently remove catalytic elements from a crystalline semiconductor film. An Ni film is formed so as to come in contact with a semiconductor thin film of low crystallinity made of an amorphous silicon film, a microcrystalline silicon film or the like. The semiconductor thin film 12 of low crystallinity is heated at 450 to 650° C. to form a crystalline semiconductor thin film in which Ni is diffused. The film is again heated at 500 to 1,100° C. to crystallize amorphous components remained in the semiconductor film to form a crystalline semiconductor film of enhanced crystallinity. Next, the crystalline semiconductor film is irradiated with a laser light or an intense light to have easily diffused Ni that is locally present in the semiconductor film in a form of silicide. Catalytic elements are then selectively added in the crystalline semiconductor film to form XV-element added regions. Subsequently, heating at 500 to 850° C., the catalytic elements remained in a region to be gettered are absorbed in the XV-element added regions.
A method of manufacturing a semiconductor device comprising steps of:
A method of manufacturing a semiconductor device comprising steps of:
A method of manufacturing a semiconductor device comprising steps of:
A method of manufacturing a semiconductor device comprising steps of:
Dependencies are inferred from the claim text.