Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara
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Abstract
In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 μm, and a maximum particle diameter of up to 20 μm is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.
Claims3
A sealing material for flip-chip type semiconductor devices in the form of a liquid epoxy resin composition comprising
- (A) a liquid epoxy resin,
- (B) an inorganic filler, and
- (C) a curing accelerator having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1 to 5 μm, and a maximum particle diameter of up to 20 μm, and represented by the following general formula (1):
- wherein R1 and R2 each are hydrogen, methyl, ethyl, hydroxymethyl or phenyl, R3 is methyl, ethyl, phenyl or allyl, and R4 is hydrogen or a group of the following formula (2):
Dependencies are inferred from the claim text.