Polishing device
AssigneeEbara Corporation
InventorsNorio Kimura, Toru Maruyama, Shunichiro Kojima, Seiji Katsuoka, Shin Ohwada
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AssigneeEbara Corporation
InventorsNorio Kimura, Toru Maruyama, Shunichiro Kojima, Seiji Katsuoka, Shin Ohwada
Estimating the term…
A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a turntable with a polishing cloth mounted on an upper surface thereof and a top ring for polishing a semiconductor wafer to a flat mirror finish by placing the semiconductor wafer between the turntable and the top ring and pressing the semiconductor wafer under a certain pressing force. A presser ring is vertically movably provided around the top ring. A pressing device presses the presser ring against the polishing cloth under a variable pressing force, and the presser ring is supported by the top ring through a bearing.
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
Dependencies are inferred from the claim text.