Chemical-mechanical polish machines and fabrication process using the same

A chemical mechanical polishing machine, comprising:

• a polishing table;
• a polishing pad on the polishing table;
• a slurry supplier, to supply slurry onto the polishing table for polishing a wafer;
• a polishing head, to dispose the wafer therein;
• and
• a retainer ring, at the bottom edge of the polishing head to retain the wafer;
• wherein:
• the wafer is retained by the retainer ring with its surface to be polished facing the polishing pad;
• and
• the retainer ring further comprises:
• a plurality of slurry passage to direct the slurry supplied by the slurry supplier through the retainer ring over the surface of the wafer;
• and
• a circular path intercrossing the slurry passages between an inner perimeter and an outer perimeter of the retainer ring.

A chemical mechanical polishing machine, comprising:

• a polishing table;
• a polishing pad on the polishing table;
• a slurry supplier, to supply slurry onto the polishing table for polishing a wafer;
• a polishing head, to dispose the wafer therein;
• and
• a retainer ring at the bottom edge of the polishing head to retain the wafer, wherein
• the retainer ring has a plurality of slurry passages to direct the slurry supplied by the slurry supplier through the retainer ring over the surface of the wafer, and the slurry passages are designed in such a way with a gradually expanding path for slurry from an outer perimeter to an inner perimeter of the retainer ring.