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US 6,293,848 B1Granted
Composition and method for planarizing surfaces
AssigneeCabot Microelectronics Corporation
InventorsMingming Fang, Brian L. Mueller, James A. Dirksen
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AssigneeCabot Microelectronics Corporation
InventorsMingming Fang, Brian L. Mueller, James A. Dirksen
Estimating the term…
A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
A composition for planarizing or polishing a surface comprising (a) a liquid carrier, (b) a chemical accelerator, and (c) solids comprising about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm.
A method of planarizing or polishing a surface comprising contacting a surface with a composition comprising (a) a liquid carrier, (b) a chemical accelerator, and (c) solids comprising about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm.
Dependencies are inferred from the claim text.