Substrate transfer system for semiconductor processing equipment

A method of transferring a substrate with respect to a susceptor in a chamber comprising the steps of:

• producing relative vertical movement between an inner susceptor section and an outer susceptor section so that the inner section is spaced above the outer section;
• moving a substrate with a forked tool into a position spaced above said susceptor with the tool engaging the lower surface of the substrate adjacent the outer periphery of substrate;
• providing relative vertical movement between said inner section and said outer section and between said inner section and said tool to engage the substrate with the inner section and transfer the substrate to the inner section, with portions of the substrate overlapping the inner section;
• withdrawing the tool;
• and
• producing relative vertical movement between said susceptor sections to cause the inner section to fit within and be supported by the outer susceptor section forming a susceptor unit for supporting said substrate.

An apparatus for processing semiconductor wafers comprising:

• a process chamber;
• a wafer support;
• a robotic arm having an end effector mounted thereon for supporting a semiconductor wafer, the end effector being adapted to be inserted into and withdrawn from said chamber;
• said end effector having a pair of spaced support arms which are joined at one end and adapted to be connected to said robotic arm, said end effector arms defining an open end, said end effector arms being spaced so that when inserted into said chamber, the arms are positioned to be vertically aligned with only peripheral portions of said wafer support so that structure for transferring a wafer to and from the wafer support will fit between the end effector arms, and so that the end effector arms will only engage the bottom surface of peripheral portions of a wafer.

A method of transferring a substrate within a chamber, comprising the steps of:

• producing relative vertical movement between a substrate and an outer susceptor section to position said substrate on support structure spaced above the outer section;
• inserting a forked end effector spaced beneath the substrate and above the outer section, the end effector having support arms which are spaced sufficiently to straddle said support structure;
• and
• producing relative vertical movement between the support structure and the end effector to cause the substrate to be transferred to a plurality of end effector projections engaging said substrate only adjacent its outer edge.

A method of transferring a thin, flat substrate to a susceptor comprising the steps of:

• inserting a forked end effector into a chamber above a susceptor with said substrate supported on the end effector, said end effector having a pair of spaced support arms joined at one end and having free ends defining an open end, said arms engaging the lower surface of said substrate adjacent an outer edge of the substrate;
• vertically separating the substrate from the end effector;
• withdrawing the end effector from the chamber;
• and
• transferring the substrate to the susceptor.

A method of transferring a thin, flat substrate comprising the steps of:

• positioning said substrate on a forked end effector having a pair of spaced support arms joined at one end and having free ends defining an open end, said end effector being configured to only engage the lower surface of said substrate adjacent an outer edge of the substrate;
• inserting the end effector and the substrate into a chamber above the susceptor;
• and
• transferring the substrate to structure which fits within the arms of the end effector by producing relative vertical movement between the end effector and said structure.