Method and apparatus for heat dissipation in a multi-processor module

A circuit assembly comprising:

• an electronic component cooled by air flow from an air mover;
• a heat sink dissipating heat from said electronic component, said heat sink including a base mounted and thermally coupled to said electronic component to receive heat transferred from said electronic component, said base having a center extending along the direction of said air flow from said air mover, said heat sink also including a plurality of fins projecting from said base and extending along the direction of said air flow from said air mover, each of two adjacent fins being positioned on opposite sides of said center of said base and being spaced laterally from said center of said base, said adjacent fins defining an open gap extending across said center of said base;
• and
• an adjacent electronic component cooled by said air flow from said air mover, said adjacent electronic component being located downstream of said electronic component;
• said gap between said adjacent fins of said heat sink reducing the temperature increase of air flowing adjacent said center of said base of said heat sink from said air mover to said adjacent electronic component.