MOS buffer immun to ESD damage
AssigneeWindbond Electronics Corp.
InventorTa-Lee Yu
Life of this patent
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Abstract
A buffer is integrated with an ESD protection circuit onto a semiconductor substrate. The ESD protection circuit is triggered by means of a MOS-like device having a first spreading resistance during an ESD event. The buffer includes a plurality of finger-type devices connected in parallel, where each finger-type device is provided with a second spreading resistance less than the first spreading resistance.
Claims4
A buffer integrated with an ESD protection circuit onto a semiconductor substrate, said ESD protection circuit being triggered by means of a MOS-like device having a first spreading resistance during an ESD event, said buffer comprising:
- at least one source region and a plurality of drain regions alternately formed in said semiconductor substrate;
- a plurality of gate structures formed on said semiconductor substrate between each said drain region and said at least source region, respectively;
- and
- a doped region formed in said at least one source region;
- wherein said at least source region, gate structures, and drain regions constitute finger-type devices, each said finger-type device having a second spreading resistance less than said first spreading resistance.
Dependencies are inferred from the claim text.