Hybrid electro-optic device with combined mirror arrays

An optical signal processing apparatus which comprises:

• a) a base;
• and,
• b) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors each being individually movable in response to an electrical signal, and a plurality of electrical leads for conducting the electrical signal to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base,
• wherein four mirror array chips are mounted to the upper surface of the base.

An optical signal processing apparatus which comprises:

• a) a base;
• and,
• b) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors each being individually movable in response to an electrical signal, and a plurality of electrical leads for conducting the electrical signal to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base,
• wherein the lead wires are sufficiently sized and spaced to carry a voltage of up to about 150 volts.

An electro-optic signal processing assembly which comprises:

• a) an optical signal processing apparatus which includes
• i) a base, and
• ii) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors being movable in response to respectively directed electrical signals, and a plurality of electrical leads for conducting the electrical signals to the respective mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base;
• b) a plurality of optical fibers for individually conveying light beams to respective mirrors of the mirror array chips;
• c) a plurality of receptors for individually receiving light beams reflected by respective mirrors of the mirror array chips;
• and
• d) at least one electrical circuit for processing electrical signals to be conducted by the electrical leads to the respective mirrors,
• wherein the optical signal processing apparatus includes at least four electrical leads for each mirror.