Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment

A method for protecting an integrated circuit wafer from electrostatic discharge, the wafer having a circuit side, comprising the steps of:

• a) providing a film having a dissipative layer and a insulating layer;
• b) locating the film in contact with the circuit side of the wafer such that the insulating layer is interposed between the dissipative layer and the wafer;
• c) positioning the wafer and the film inside of a container;
• d) passing a static charge from the wafer to the dissipative layer through the insulating layer and out of the container to an exterior of the container.

A system for protecting integrated circuit wafers during storage and shipment, comprising:

• a) a container having an interior an interior space for receiving the wafers;
• b) first and second cushions positioned inside of the interior space so as to receive the wafers therebetween;
• c) each of the first and second cushions comprising compressible and resilient foam;
• d) the first and second cushions comprising a dissipative path for electrical charges;
• e) a grounding conductor in contact with a portion of the dissipative path of at least one of the first and cushions and extending to an exterior of the container, the first and second cushions and extending to an exterior of the container.