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US 6,285,549 B1Granted
Power package lead frame
AssigneeAuk Corp.
InventorTeng Yul Lee
Life of this patent
Estimating the term…
Abstract
A power package lead frame comprises a lead frame, a chip attached to the lead frame, and a mold encasing the chip and a portion of the lead frame. The lead frame comprises a paddle part, a radiation plate, and a leg part. The radiation plate comprises a first plate extending from the paddle part and a second plate extending from the first plate. The first and second plates have the same thickness as the paddle part or the leg part. The second plate is folded towards the first plate and fixed tightly thereto, so that the radiation plate is twice as thick as the paddle part or the leg part.
Claims3
A power package lead frame comprising:
- a lead frame having a paddle part, a radiation plate, and a leg part;
- a chip connected to the paddle part of said lead frame;
- and
- a mold encasing said chip and a portion of the leg part and the paddle part of said lead frame,
- wherein the radiation plate of said lead frame comprises a first plate extending from the paddle part and having the same thickness as the paddle part or the leg part, and a second plate extending from the first plate and having the same thickness as the first plate;
- and the second plate is folded towards the first plate, superposing tightly thereto, so that the radiation plate is twice as thick as the paddle part or the leg part.
3 more elements
Dependencies are inferred from the claim text.